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KEYWORD_EN:CMP 2 result(s) found
 
1. Particle Size Analysis of Chemical Mechanical Polishing (CMP) Powder Using Sedimentation Field-Flow Fractionation (SdFFF)

솔 김;선태 김;동영 강;승호 이;
Journal of the Korean Chemical Society, vol. 57, iss. 1, 2013, pp. 159-164
 
2. Application of Surfactant added DHF to Post Oxide CMP Cleaning process

청 류;유혁 김;
Journal of the Korean Chemical Society, vol. 47, iss. 6, 2003, pp. 608-613
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